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Manufacturing Equipment (Wire Cutting Machine) for Semiconductors, Solar Cells, LEDs, and Power Semiconductors

Capable of machining all materials used in the IT industry including semiconductors, solar cells, LEDs, and power semiconductors

Model

  • TWP-500DL

    [Fixed-abrasive-grain wire cutting machine]
    This mode can machine solar wafers. With a fixed-abrasive-grain wire and a separate wired web, it provides excellent accuracy, yield, and productivity.

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  • TWG-300

    [Fixed-abrasive-grain wire cutting machine]
    This model quickly cuts difficult-to-cut materials such as sapphire, SiC (silicon carbide), GaN (gallium nitride) ingots to provide high productivity.

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